Customer Notifications
| PCN-2013-02 |
2013-04-30 |
Site Expansion |
Enpirion is expanding its manufacturing capacity to add a second source. |
| PCN-2011-02 |
2011-09-12 |
Material Change |
Enpirion is converting to copper wire as a qualified wire bond material for device packaging: EN5310DC, EN5310DI, EN5330DC, EN5330DI. |
| PCN-2011-01 |
2011-09-12 |
Material Change |
Enpirion is converting to copper wire as a qualified wire bond material for QFN devices: EN5335QI, EN5336QI, EN5365QI, EN5366QI, EN5364QI, EN5394QI
EN5395QI, EN5396QI, EA100BCM, EA108BCM, EN104INT, EN110INT. |
| PCN-2010-02r01 |
2011-01-05 |
Material Change |
Enpirion is converting to copper wire as a qualified wire bond material for QFN devices: EN5337QI, EN5327QI, EA101BCM, EN109INT, EX3AV. |
| PCN-2010-01 r01 |
2010-06-28 |
Material & Site Change |
Enpirion has qualified copper bond material for QFN devices at HANA Semiconductor, Thailand: EN5322QI, EA102BCM, EN103INT, EN106AMN. |
| PCN-2010-02 |
2010-04-12 |
Material Change |
Enpirion is converting to copper wire as a qualified wire bond material for QFN devices: EN5337QI, EN5327QI, EA101BCM, EN109INT, EX3AV. |
| PCN-2010-01 r00 |
2010-04-12 |
Material & Site Change |
Enpirion is converting to copper wire as a qualified wire bond materialfro QFN devices. The device assembly will be done at HANA Semiconductor, Thailand: EN5322QI, EA102BCM, EN103INT, EN106AMN. |
| PDN-2009-01 |
2009-02-16 |
Product Discontinuation |
EN5360DC, EN5360DI - This product has become obsolete and replaced by newer products. |
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