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7/6/2008
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 Qualification Requirements for Plastic Packages
Test

Test Condition

Standard
Accelerated Moisture Resistance Unbiased HAST with Pre-conditioning (Note 1)
Continuous storage in 85% Relative Humidity; Non-operating ambient temperature is 130°C; Pressure is 33 psia; Test duration is 96 hours.
JESD22-A118 Class A
Temperature Cycle with Pre-Conditioning (Note 1)
Alternating hot and cold air; Non-operating temperature extremes are –65°C to +150°C; Minimum 15 minute dwell time at each temperature extreme; Test duration is 500 cycles.

JESED22-A104-C Test Condition CSoak Mode 4

Temperature Humidity Bias with Pre-Conditioning (Note 1, 2)
Continuous operation at rated supply voltage and minimum power; Ambient temperature is 85°C; Relative Humidity is 85%; Test duration is 1000 hours.
JESD22-A101-B
Operating Life (HTOL)(Note 2)
Continuous operation at rated supply voltage; Junction temperature is 125°C; Test duration is 1000 hours
JESD22-A108-C
High Temperature Storage
Continuous storage in air; Non-operating ambient temperature is 150°C;Test duration is 1000 hours

JESD22-A-103-CHigh Temperature Storage Condition B

Electrostatic Discharge
Human Body Model, 2000V minimum

JESD22-A-114-C01
Class 2

Electrostatic Discharge
Machine Model; 200V minimum
JESD-A-115-A
Electrostatic Discharge
Charge Discharge Model; 200V minimum
JESD-C-101-C
IC Latch-Up
I-test and over-voltage latch-up testing for integrated circuits; Non-operating ambient temperature 25°C and maximum ambient operating temperature

JESD78
Class I & II

Solderability
Eight(8) hour steam age, followed by 5 second dwell in solder at 245°C; Pb-Free Solder.

JESD22-B-102-D
Method 1; Pb-Free

Physical Dimensions
Physical Dimensions, including length, width, and height. Additional measurements may include co-planarity, pad locations and pad dimensions.
JESD22-B-100-B
Acoustic Micro Imaging
C-mode Scanning Acoustic Microscope; Interface and Thru Scans
J-STD-020-C

Note 1:
Pre-Conditioning stress defined by JESD22-A-113-D / J-STD-020-C
For Substrate and Lead-Frame based packages: Pb-Free MSL3
Note 2:

Continuous Device Input Current Monitoring


Qualification Requirements for New Product & Changes to Existing Products
 

 

New/Change Process Change Description
Die
Design
Within qualified design rules
X
X
Wafer
Processing
Beyond qualified design rules
X
X
X
X
X
X
Lithography
x
x
x
x
Diffusion/doping
x
x
x
Polysilicon
x
x
x
x
x
Metalization
x
x
x
x
x
Passivation/oxide
x
x
x
x
x
x
x
Backside operation
x
x
x
Foundary change
x
x
x
x
x
x
x
Major Technology Change
x
x
x
x
x
x
x
Package
Assembly
Package Size (new mold)
x
x
x
x
Molding Compound
x
x
x
x
x
x
x
Molding Process
x
x
x
x
x
x
x
Die Attach Material
x
x
x
x
x
Solder for Discretes
x
x
x
Components Substrate
Leadframe
Assembly Location Change
x
x
x
x
x
x
x
    Vendor Change
x
x
    Material/Technology Change
x
x
x
x
x
x
    Design/Dimension Changes
x
x
x
x
  Inductor Technology
x
x
x
x
    Physical Size
x
x
x
  Passives Physical Size
x
x
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